Advanced packaging has become a prominent technology in semiconductor manufacturing. TSMC, the leading foundry, cooperates with EDA manufacturers and Ansys to create a comprehensive thermal analysis solution with multi-chip design constructed by 3D Fabric. 3D Fabric is a comprehensive series of TSMC’s 3D silicon stack and advanced packaging technology. , based on Ansys tools, applied to simulate the temperature of 3D and 2.5D Electronic systems containing multiple chips, tightly stacked using advanced TSMC 3D Fabric technology. Sophisticated thermal analysis prevents these systems from failing due to overheating and increases lifetime reliability.
TSMC cooperated with Ansys to use Ansys Icepak as a reference for thermal analysis of TSMC 3D Fabric technology. Ansys is also working with TSMC to develop high-capacity layered thermal solutions, using Ansys RedHawk-SC Electrothermal to analyze complete chip packaging systems with high-fidelity results.
Ansys Icepak is a simulation software product that simulates airflow, heat flow, temperature and cooling in electronic components through computational fluid dynamics (CFD). Ansys RedHawk-SC Electrothermal is a simulation software product for solving multi-physics power integrity, signal integrity and thermal equations of 2.5D/3D multi-chip IC systems. Ansys RedHawk-SC is a semiconductor power integrity and reliability analysis tool certified by TSMC for verification at all finFET process nodes of the latest 4nm and 3nm.
The cooperation between TSMC and Ansys, on October 26, TSMC’s 2021 Open Innovation Platform (OIP) Ecosystem Forum, released an Ansys solution paper titled “A Comprehensive Hierarchical Thermal Solution for Advanced 3DIC Systems” (AComprehensive Hierarchical Thermal Solution for Advanced 3DIC Systems), TSMC expanded the Ansys Red Hawk series cooperation and included ReedHawk-SC for electromigration and voltage drop (EM/IR) verification of TSMC-SoIC technology, which is the most comprehensive chip stacking technology for 3D Fabric.
Suk Lee, vice president of TSMC’s Design and Construction Management Office, said that TSMC is working closely with OIP ecosystem partners to use TSMC’s advanced process and 3D Fabric technology to bring significant benefits in power, performance and area to enable next-generation designs. This collaboration with Ansys provides a thermal solution process for complete chip and package analysis, which is of great value to TSMC customers.
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