Beijing, China, March 17, 2021 – Adaptive computing leader Xilinx (NASDAQ: XLNX) today announced the market expansion of its UltraScale+ product portfolio to support new applications requiring ultra-compact and intelligent edge solutions. The new Artix® and Zynq® UltraScale+ devices offer a 70 percent smaller form factor than traditional chip packages, addressing a wider range of applications in the industrial, vision, medical, broadcast, consumer, automotive and connected markets.
As the world’s only 16nm technology-based hardware flexible cost-optimized portfolio, Artix and Zynq UltraScale+ devices feature TSMC’s most advanced InFO (Integrated Fan Out) packaging technology. With InFO technology, Artix and Zynq UltraScale+ devices address the demands of intelligent edge applications by delivering high compute density, excellent performance per watt, and scalability in a compact package.
Sumit Shah, senior director of product line management and marketing at Xilinx, said: “The need for compact intelligent edge applications is driving up the need for processing and bandwidth engines. These engines must not only provide higher performance, but also higher levels of Compute density to support the smallest form factor systems. The UltraScale+ family is powered by new cost-optimized products. It is based on the Xilinx UltraScale+ FPGA and MPSoC architectures and production-proven technologies that have long worked together Deployed in millions of systems around the world.”
Artix UltraScale+ FPGAs: Built for High I/O Bandwidth and DSP Computing
Based on a production-proven FPGA architecture, the Artix UltraScale+ family is ideal for a range of applications such as machine vision with advanced sensor technology, high-speed interconnect, and ultra-compact “8K-ready” video broadcasting. Artix UltraScale+ devices provide 16Gb-per-second transceivers to support emerging high-end protocols in the interconnect, vision and video domains, while enabling best-in-class DSP computing capabilities.
Figure: Xilinx Artix UltraScale+ FPGAs for High I/O Bandwidth and DSP Computing
Zynq UltraScale+ MPSoC: Optimized for Power and Cost
The cost-optimized Zynq UltraScale+ MPSoC includes the new ZU1 and production-proven ZU2 and ZU3 devices, all in InFO packages. Part of the Zynq UltraScale+ family of multiprocessing SoCs, the ZU1 is designed for edge connectivity and industrial and medical IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, handheld test equipment, and Consumer and medical applications, etc. The ZU1 is built for small, compute-intensive applications and features a multi-core processor subsystem based on heterogeneous Arm® processors, while migrating to common package sizes to support higher computing power.
Figure: Xilinx Zynq UltraScale+ MPSoC optimized for power and cost
“LUCID has worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next-generation industrial machine vision camera, the Triton™ Edge,” said Rod Barman, founder and president of LUCID Vision Labs. “With the UltraScale+ ZU3 and its InFO package, LUCID is able to leverage the The innovative rigid-flex board architecture packs incredible processing power into a factory-grade rugged, ultra-compact IP67 camera.”
Scalable and secure Artix and Zynq UltraScale+
With the addition of the new Artix devices and the expansion of the Zynq UltraScale+ family, Xilinx’s product portfolio now spans from the Virtex® UltraScale+ high-end family, the Kintex® UltraScale+ mid-range family to the new cost-optimized low-end family. The introduction of the new devices complements Xilinx’s product portfolio and provides customers with the scalability to develop multiple solutions using the same Xilinx platform. This preserves design investment across different product portfolios and accelerates time-to-market.
Security is a critical component in Xilinx’s design. The new devices in the cost-optimized Artix and Zynq UltraScale+ families have the same robust security features as the UltraScale+ platform, including RSA-4096 authentication, AES-CGM decryption, Data Protection Act (DPA), and Xilinx proprietary The Security Monitor (SecMon, security monitoring) IP can flexibly respond to security threats in the product life cycle and meet various security needs of commercial projects.
Dan Mandell, Senior Analyst, IoT and Embedded Technologies, VDC Research, said: “The ability for customers to scale their designs to accommodate a wide range of applications and market needs with a single and secure platform is critical for easier design integration and control. Time-to-market opportunities are critical. Xilinx’s strategy to expand its product portfolio to address these market needs with the scalable and secure UltraScale+ Artix and Zynq families is attractive, especially given the There are huge opportunities in growth markets.”
The first cost-optimized Artix UltraScale+ devices are expected to be in production in the third quarter of 2021, with support for the Vivado® Design Suite and VitisTM unified software platform tools beginning in late summer. Tooling support for the Zynq UltraScale+ ZU1 device will be available in the second quarter, with samples available in the third quarter; mass production of the broad product portfolio will begin in the fourth quarter.